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System On Chip (SoC)

Browse available System On Chip (SoC) part numbers with manufacturer references, stock information, pricing, datasheets and key specifications. Use the table below to compare options for your project.

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Photo Mfr. Part # Availability Price Quantity Datasheet Series Package/Case Packaging Product Status Architecture Core Processor Flash Size RAM Size Peripherals Connectivity Speed Primary Attributes Operating Temperature Grade Qualification Supplier Device Package
5CSXFC6C6U23C6N Intel

5CSXFC6C6U23C6N

IC SOC CORTEX-A9 925MHZ 672UBGA

Intel

2,089 -
Datasheet Cyclone® V SX 672-FBGA Tray Active MCU, FPGA Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ - 64KB DMA, POR, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 925MHz FPGA - 110K Logic Elements 0°C ~ 85°C (TJ) - - 672-UBGA (23x23)
5CSXFC6C6U23I7NTS Intel

5CSXFC6C6U23I7NTS

IC SOC CORTEX-A9 925MHZ 672UBGA

Intel

4,514 -
Datasheet Cyclone® V SX 672-FBGA Tray Active MCU, FPGA Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ - 64KB DMA, POR, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 925MHz FPGA - 110K Logic Elements -40°C ~ 100°C (TJ) - - 672-UBGA (23x23)
88MW322-A0-NXUE/AZ NXP Semiconductors

88MW322-A0-NXUE/AZ

88MW322 - 88MW32X 802.11n Wi-Fi

NXP Semiconductors

9,970 -
Datasheet - 88-VFQFN Exposed Pad Bulk Active MPU ARM® Cortex®-M4F - 512kB DMA, PWM I2C, SPI, SSP, UART 200MHz - -30°C ~ 85°C - - 88-QFN (10x10)
TA7S04-60QC Triscend

TA7S04-60QC

RISC MICROPROCESSOR, 32-BIT, 60M

Triscend

214 -
Datasheet * - Bulk Active - - - - - - - - - - - -
TA7S20-60GC Triscend

TA7S20-60GC

RISC MICROPROCESSOR, 32-BIT, 60M

Triscend

106 -
Datasheet * - Bulk Active - - - - - - - - - - - -
UPD63F810GM(A)-8EV-A Renesas

UPD63F810GM(A)-8EV-A

UPD63F810GM - CD TUNER IC

Renesas

198 -
Datasheet * - Bulk Active - - - - - - - - - - - -
MSC7104ZQF Freescale Semiconductor - NXP

MSC7104ZQF

MSC7104 - INTEGRATED GPON OPTICA

Freescale Semiconductor - NXP

1,560 -
Datasheet - 456-BBGA Bulk Obsolete MPU PowerPC e300 - - DDR2, JTAG Ethernet, I2C, SPI, UART/USART 266MHz - - - - 456-PBGA (35x35)
5CSXFC6C6U23C8N Intel

5CSXFC6C6U23C8N

IC SOC CORTEX-A9 600MHZ 672UBGA

Intel

4,226 -
Datasheet Cyclone® V SX 672-FBGA Tray Active MCU, FPGA Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ - 64KB DMA, POR, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 600MHz FPGA - 110K Logic Elements 0°C ~ 85°C (TJ) - - 672-UBGA (23x23)
XC7Z030-1FBG676I AMD

XC7Z030-1FBG676I

IC SOC CORTEX-A9 667MHZ 676FCBGA

AMD

3,344 -
Datasheet Zynq®-7000 676-BBGA, FCBGA Tray Active MCU, FPGA Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ - 256KB DMA CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 667MHz Kintex™-7 FPGA, 125K Logic Cells -40°C ~ 100°C (TJ) - - 676-FCBGA (27x27)
XC7Z030-2SBG485I AMD

XC7Z030-2SBG485I

IC SOC CORTEX-A9 800MHZ 485FCBGA

AMD

2,785 -
Datasheet Zynq®-7000 484-FBGA, FCBGA Tray Active MCU, FPGA Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ - 256KB DMA CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 800MHz Kintex™-7 FPGA, 125K Logic Cells -40°C ~ 100°C (TJ) - - 484-FCBGA (19x19)
XC7Z030-1FFG676I AMD

XC7Z030-1FFG676I

IC SOC CORTEX-A9 667MHZ 676FCBGA

AMD

2,001 -
Datasheet Zynq®-7000 676-BBGA, FCBGA Tray Active MCU, FPGA Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ - 256KB DMA CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 667MHz Kintex™-7 FPGA, 125K Logic Cells -40°C ~ 100°C (TJ) - - 676-FCBGA (27x27)
5CSXFC6D6F31C6N Intel

5CSXFC6D6F31C6N

IC SOC CORTEX-A9 925MHZ 896FBGA

Intel

1,281 -
Datasheet Cyclone® V SX 896-BGA Tray Active MCU, FPGA Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ - 64KB DMA, POR, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 925MHz FPGA - 110K Logic Elements 0°C ~ 85°C (TJ) - - 896-FBGA (31x31)
MPFS250T-FCG1152I Microchip Technology

MPFS250T-FCG1152I

IC SOC RISC-V 1152FCBGA

Microchip Technology

2,615 -
Datasheet PolarFire® 1152-BBGA, FCBGA Tray Active MPU, FPGA RISC-V 128kB 2.2MB DMA, PCI, PWM CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG - FPGA - 254K Logic Modules -40°C ~ 100°C - - 1152-FCBGA (35x35)
MPFS250TS-FCG1152I Microchip Technology

MPFS250TS-FCG1152I

IC SOC RISC-V 1152FCBGA

Microchip Technology

2,103 -
Datasheet PolarFire® 1152-BBGA, FCBGA Tray Active MPU, FPGA RISC-V 128kB 2.2MB DMA, PCI, PWM CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG - FPGA - 254K Logic Modules -40°C ~ 100°C - - 1152-FCBGA (35x35)
XCZU3EG-1SFVC784I AMD

XCZU3EG-1SFVC784I

IC SOC CORTEX-A53 784FCBGA

AMD

3,112 -
Datasheet Zynq® UltraScale+™ MPSoC EG 784-BFBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 - 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 600MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 154K+ Logic Cells -40°C ~ 100°C (TJ) - - 784-FCBGA (23x23)
XCZU9EG-2FFVB1156I AMD

XCZU9EG-2FFVB1156I

IC SOC CORTEX-A53 1156FCBGA

AMD

2,860 -
Datasheet Zynq® UltraScale+™ MPSoC EG 1156-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 - 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 600MHz, 1.3GHz Zynq®UltraScale+™ FPGA, 599K+ Logic Cells -40°C ~ 100°C (TJ) - - 1156-FCBGA (35x35)
M2S005-VFG400I Microchip Technology

M2S005-VFG400I

IC SOC CORTEX-M3 166MHZ 400VFBGA

Microchip Technology

2,688 -
Datasheet SmartFusion®2 400-LFBGA Tray Active MCU, FPGA ARM® Cortex®-M3 128KB 64KB DDR CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 5K Logic Modules -40°C ~ 100°C (TJ) - - 400-VFBGA (17x17)
MIMX9352XVVXMAB NXP USA Inc.

MIMX9352XVVXMAB

MIMX9352XVVXMAB

NXP USA Inc.

3,897 -
Datasheet - 306-LFBGA Tray Active - - - - - - - - - - - 306-LFBGA (11x11)
MPFS025T-FCSG325I Microchip Technology

MPFS025T-FCSG325I

IC SOC RISC-V 325BGA

Microchip Technology

3,210 -
Datasheet PolarFire® 325-TFBGA Tray Active MPU, FPGA RISC-V 128KB 230.4KB DMA, PCI, PWM CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG - FPGA - 23K Logic Modules -40°C ~ 100°C - - 325-BGA (11x11)
M2S025-FGG484 Microchip Technology

M2S025-FGG484

IC SOC CORTEX-M3 166MHZ 484FBGA

Microchip Technology

3,253 -
Datasheet SmartFusion®2 484-BGA Tray Active MCU, FPGA ARM® Cortex®-M3 256KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 25K Logic Modules 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
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FREQUENTLY ASKED QUESTIONS

System On Chip (SoC) FAQ

Common questions about selecting, comparing and sourcing System On Chip (SoC) components through Winsun (HK) Electronics.

What should I check when selecting System On Chip (SoC) components?

Compare the manufacturer part number, electrical specifications, package, operating conditions and application requirements. The product datasheet should be used to confirm technical suitability.

Can Winsun help source specific System On Chip (SoC) part numbers?

Yes. Send the exact part number, manufacturer and required quantity. Winsun (HK) Electronics can assist with availability checks, quotation support and sourcing options based on your requirement.

Do you support shortage, obsolete or hard-to-find System On Chip (SoC) parts?

Yes. Our sourcing team can review shortage and obsolete-part requirements and help check available supply channels or possible alternatives when appropriate.

How do I request a quote for System On Chip (SoC) components?

Submit an RFQ with the part number, manufacturer, quantity and target delivery requirement. Our sales team will review your request and follow up with current sourcing information.