System On Chip (SoC)
Browse available System On Chip (SoC) part numbers with manufacturer references, stock information, pricing, datasheets and key specifications. Use the table below to compare options for your project.
For BOM, shortage or hard-to-find requirements, send your part number and quantity to Winsun (HK) Electronics for availability, lead-time and quotation support.
| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Architecture | Core Processor | Flash Size | RAM Size | Peripherals | Connectivity | Speed | Primary Attributes | Operating Temperature | Grade | Qualification | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
5CSXFC6C6U23C6NIC SOC CORTEX-A9 925MHZ 672UBGA |
2,089 | - |
|
Datasheet | Cyclone® V SX | 672-FBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 64KB | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 925MHz | FPGA - 110K Logic Elements | 0°C ~ 85°C (TJ) | - | - | 672-UBGA (23x23) |
|
5CSXFC6C6U23I7NTSIC SOC CORTEX-A9 925MHZ 672UBGA |
4,514 | - |
|
Datasheet | Cyclone® V SX | 672-FBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 64KB | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 925MHz | FPGA - 110K Logic Elements | -40°C ~ 100°C (TJ) | - | - | 672-UBGA (23x23) |
|
88MW322-A0-NXUE/AZ88MW322 - 88MW32X 802.11n Wi-Fi |
9,970 | - |
|
Datasheet | - | 88-VFQFN Exposed Pad | Bulk | Active | MPU | ARM® Cortex®-M4F | - | 512kB | DMA, PWM | I2C, SPI, SSP, UART | 200MHz | - | -30°C ~ 85°C | - | - | 88-QFN (10x10) |
|
TA7S04-60QCRISC MICROPROCESSOR, 32-BIT, 60M |
214 | - |
|
Datasheet | * | - | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - |
|
TA7S20-60GCRISC MICROPROCESSOR, 32-BIT, 60M |
106 | - |
|
Datasheet | * | - | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - |
|
UPD63F810GM(A)-8EV-AUPD63F810GM - CD TUNER IC |
198 | - |
|
Datasheet | * | - | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - |
|
MSC7104ZQFMSC7104 - INTEGRATED GPON OPTICA |
1,560 | - |
|
Datasheet | - | 456-BBGA | Bulk | Obsolete | MPU | PowerPC e300 | - | - | DDR2, JTAG | Ethernet, I2C, SPI, UART/USART | 266MHz | - | - | - | - | 456-PBGA (35x35) |
|
5CSXFC6C6U23C8NIC SOC CORTEX-A9 600MHZ 672UBGA |
4,226 | - |
|
Datasheet | Cyclone® V SX | 672-FBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 64KB | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 600MHz | FPGA - 110K Logic Elements | 0°C ~ 85°C (TJ) | - | - | 672-UBGA (23x23) |
|
|
XC7Z030-1FBG676IIC SOC CORTEX-A9 667MHZ 676FCBGA |
3,344 | - |
|
Datasheet | Zynq®-7000 | 676-BBGA, FCBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 667MHz | Kintex™-7 FPGA, 125K Logic Cells | -40°C ~ 100°C (TJ) | - | - | 676-FCBGA (27x27) |
|
XC7Z030-2SBG485IIC SOC CORTEX-A9 800MHZ 485FCBGA |
2,785 | - |
|
Datasheet | Zynq®-7000 | 484-FBGA, FCBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 800MHz | Kintex™-7 FPGA, 125K Logic Cells | -40°C ~ 100°C (TJ) | - | - | 484-FCBGA (19x19) |
|
XC7Z030-1FFG676IIC SOC CORTEX-A9 667MHZ 676FCBGA |
2,001 | - |
|
Datasheet | Zynq®-7000 | 676-BBGA, FCBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 667MHz | Kintex™-7 FPGA, 125K Logic Cells | -40°C ~ 100°C (TJ) | - | - | 676-FCBGA (27x27) |
|
5CSXFC6D6F31C6NIC SOC CORTEX-A9 925MHZ 896FBGA |
1,281 | - |
|
Datasheet | Cyclone® V SX | 896-BGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 64KB | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 925MHz | FPGA - 110K Logic Elements | 0°C ~ 85°C (TJ) | - | - | 896-FBGA (31x31) |
|
MPFS250T-FCG1152IIC SOC RISC-V 1152FCBGA |
2,615 | - |
|
Datasheet | PolarFire® | 1152-BBGA, FCBGA | Tray | Active | MPU, FPGA | RISC-V | 128kB | 2.2MB | DMA, PCI, PWM | CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG | - | FPGA - 254K Logic Modules | -40°C ~ 100°C | - | - | 1152-FCBGA (35x35) |
|
MPFS250TS-FCG1152IIC SOC RISC-V 1152FCBGA |
2,103 | - |
|
Datasheet | PolarFire® | 1152-BBGA, FCBGA | Tray | Active | MPU, FPGA | RISC-V | 128kB | 2.2MB | DMA, PCI, PWM | CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG | - | FPGA - 254K Logic Modules | -40°C ~ 100°C | - | - | 1152-FCBGA (35x35) |
|
XCZU3EG-1SFVC784IIC SOC CORTEX-A53 784FCBGA |
3,112 | - |
|
Datasheet | Zynq® UltraScale+™ MPSoC EG | 784-BFBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 500MHz, 600MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | -40°C ~ 100°C (TJ) | - | - | 784-FCBGA (23x23) |
|
XCZU9EG-2FFVB1156IIC SOC CORTEX-A53 1156FCBGA |
2,860 | - |
|
Datasheet | Zynq® UltraScale+™ MPSoC EG | 1156-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 533MHz, 600MHz, 1.3GHz | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | -40°C ~ 100°C (TJ) | - | - | 1156-FCBGA (35x35) |
|
M2S005-VFG400IIC SOC CORTEX-M3 166MHZ 400VFBGA |
2,688 | - |
|
Datasheet | SmartFusion®2 | 400-LFBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 128KB | 64KB | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 5K Logic Modules | -40°C ~ 100°C (TJ) | - | - | 400-VFBGA (17x17) |
|
MIMX9352XVVXMABMIMX9352XVVXMAB |
3,897 | - |
|
Datasheet | - | 306-LFBGA | Tray | Active | - | - | - | - | - | - | - | - | - | - | - | 306-LFBGA (11x11) |
|
MPFS025T-FCSG325IIC SOC RISC-V 325BGA |
3,210 | - |
|
Datasheet | PolarFire® | 325-TFBGA | Tray | Active | MPU, FPGA | RISC-V | 128KB | 230.4KB | DMA, PCI, PWM | CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG | - | FPGA - 23K Logic Modules | -40°C ~ 100°C | - | - | 325-BGA (11x11) |
|
M2S025-FGG484IC SOC CORTEX-M3 166MHZ 484FBGA |
3,253 | - |
|
Datasheet | SmartFusion®2 | 484-BGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 256KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 25K Logic Modules | 0°C ~ 85°C (TJ) | - | - | 484-FPBGA (23x23) |
System On Chip (SoC) FAQ
Common questions about selecting, comparing and sourcing System On Chip (SoC) components through Winsun (HK) Electronics.
What should I check when selecting System On Chip (SoC) components?
Compare the manufacturer part number, electrical specifications, package, operating conditions and application requirements. The product datasheet should be used to confirm technical suitability.
Can Winsun help source specific System On Chip (SoC) part numbers?
Yes. Send the exact part number, manufacturer and required quantity. Winsun (HK) Electronics can assist with availability checks, quotation support and sourcing options based on your requirement.
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Yes. Our sourcing team can review shortage and obsolete-part requirements and help check available supply channels or possible alternatives when appropriate.
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Submit an RFQ with the part number, manufacturer, quantity and target delivery requirement. Our sales team will review your request and follow up with current sourcing information.