System On Chip (SoC)
Browse available System On Chip (SoC) part numbers with manufacturer references, stock information, pricing, datasheets and key specifications. Use the table below to compare options for your project.
For BOM, shortage or hard-to-find requirements, send your part number and quantity to Winsun (HK) Electronics for availability, lead-time and quotation support.
| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Architecture | Core Processor | Flash Size | RAM Size | Peripherals | Connectivity | Speed | Primary Attributes | Operating Temperature | Grade | Qualification | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
XCZU1CG-1SBVA484IIC ZUP MPSOC CG A53 FPGA 484BGA |
3,886 | - |
|
Datasheet | Zynq® UltraScale+™ MPSoC CG | 484-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DMA, WDT | - | 500MHz, 1.2GHz | - | -40°C ~ 100°C (TJ) | - | - | 484-FCBGA (19x19) |
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5CSEMA5F31I7NIC SOC CORTEX-A9 800MHZ 896FBGA |
3,860 | - |
|
Datasheet | Cyclone® V SE | 896-BGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 64KB | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 800MHz | FPGA - 85K Logic Elements | -40°C ~ 100°C (TJ) | - | - | 896-FBGA (31x31) |
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XC7Z030-1FBG484IIC SOC CORTEX-A9 667MHZ 484FCBGA |
3,208 | - |
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Datasheet | Zynq®-7000 | 484-BBGA, FCBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 667MHz | Kintex™-7 FPGA, 125K Logic Cells | -40°C ~ 100°C (TJ) | - | - | 484-FCBGA (23x23) |
|
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XCZU2EG-L1SBVA484IIC SOC CORTEX-A53 484FCBGA |
1,399 | - |
|
Datasheet | Zynq® UltraScale+™ MPSoC EG | 484-BFBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 500MHz, 600MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | -40°C ~ 100°C (TJ) | - | - | 484-FCBGA (19x19) |
|
MPFS250TS-1FCG1152IIC SOC RISC-V 1152FCBGA |
3,592 | - |
|
Datasheet | PolarFire® | 1152-BBGA, FCBGA | Tray | Active | MPU, FPGA | RISC-V | 128kB | 2.2MB | DMA, PCI, PWM | CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG | - | FPGA - 254K Logic Modules | -40°C ~ 100°C | - | - | 1152-FCBGA (35x35) |
|
SOM-2532DCBX-U0A1SBC 2.0GHZ 4 CORE 0GB/16GB RAM |
3,018 | - |
|
Datasheet | SMARC | Module | Bulk | Active | MPU | Intel® Atom® x6425E | 32GB | 16GB | HDMI, LCD, LVDS, SATA | CANbus, Ethernet, I2C, I2S, MMC/SD/SDIO, PCIe, SPI, UART, USB | 2GHz | - | -40°C ~ 85°C | - | - | - |
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XC7Z100-2FFG1156IIC SOC CORTEX-A9 800MHZ 1156BGA |
3,737 | - |
|
Datasheet | Zynq®-7000 | 1156-BBGA, FCBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 800MHz | Kintex™-7 FPGA, 444K Logic Cells | -40°C ~ 100°C (TJ) | - | - | 1156-FCBGA (35x35) |
|
XCZU9EG-2FFVB1156EIC SOC CORTEX-A53 1156FCBGA |
3,255 | - |
|
Datasheet | Zynq® UltraScale+™ MPSoC EG | 1156-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 533MHz, 600MHz, 1.3GHz | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | 0°C ~ 100°C (TJ) | - | - | 1156-FCBGA (35x35) |
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M2S010-VFG400IC SOC CORTEX-M3 166MHZ 400VFBGA |
3,364 | - |
|
Datasheet | SmartFusion®2 | 400-LFBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 256KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 10K Logic Modules | 0°C ~ 85°C (TJ) | - | - | 400-VFBGA (17x17) |
|
XC7Z014S-1CLG484CIC SOC CORTEX-A9 667MHZ 484BGA |
4,028 | - |
|
Datasheet | Zynq®-7000 | 484-LFBGA, CSPBGA | Tray | Active | MCU, FPGA | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 667MHz | Artix™-7 FPGA, 65K Logic Cells | 0°C ~ 85°C (TJ) | - | - | 484-CSPBGA (19x19) |
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5CSEMA5F31C8NIC SOC CORTEX-A9 600MHZ 896FBGA |
1,045 | - |
|
Datasheet | Cyclone® V SE | 896-BGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 64KB | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 600MHz | FPGA - 85K Logic Elements | 0°C ~ 85°C (TJ) | - | - | 896-FBGA (31x31) |
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5CSEBA6U23C7NIC SOC CORTEX-A9 800MHZ 672UBGA |
4,358 | - |
|
Datasheet | Cyclone® V SE | 672-FBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 64KB | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 800MHz | FPGA - 110K Logic Elements | 0°C ~ 85°C (TJ) | - | - | 672-UBGA (23x23) |
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5CSEMA5F31C6NIC SOC CORTEX-A9 925MHZ 896FBGA |
1,351 | - |
|
Datasheet | Cyclone® V SE | 896-BGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 64KB | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 925MHz | FPGA - 85K Logic Elements | 0°C ~ 85°C (TJ) | - | - | 896-FBGA (31x31) |
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XCZU1CG-1SFVA625IIC ZUP MPSOC CG A53 FPGA 635BGA |
4,047 | - |
|
Datasheet | Zynq® UltraScale+™ MPSoC CG | 625-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DMA, WDT | - | 500MHz, 1.2GHz | - | -40°C ~ 100°C (TJ) | - | - | 625-FCBGA (21x21) |
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5CSXFC5C6U23I7NIC SOC CORTEX-A9 800MHZ 672UBGA |
3,032 | - |
|
Datasheet | Cyclone® V SX | 672-FBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 64KB | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 800MHz | FPGA - 85K Logic Elements | -40°C ~ 100°C (TJ) | - | - | 672-UBGA (23x23) |
|
XCZU2CG-2UBVA530EIC SOC CORTEX-A53 530BGA |
4,755 | - |
|
Datasheet | - | 530-WFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 533MHz, 1.3GHz | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | 0°C ~ 100°C (TJ) | - | - | 530-FCBGA (16x9.5) |
|
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XCZU2EG-1UBVA530IIC SOC CORTEX-A53 530BGA |
1,720 | - |
|
Datasheet | - | 530-WFBGA, FCBGA | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 500MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | -40°C ~ 100°C (TJ) | - | - | 530-FCBGA (16x9.5) |
|
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MPFS250T-FCVG784EIC SOC RISC-V 784FCBGA |
2,395 | - |
|
Datasheet | PolarFire® | 784-BFBGA, FCBGA | Tray | Active | MPU, FPGA | RISC-V | 128kB | 2.2MB | DMA, PCI, PWM | CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG | - | FPGA - 254K Logic Modules | 0°C ~ 100°C | - | - | 784-FCBGA (23x23) |
|
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XCZU2CG-2UBVA530IIC SOC CORTEX-A53 530BGA |
1,336 | - |
|
Datasheet | - | 530-WFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 533MHz, 1.3GHz | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | -40°C ~ 100°C (TJ) | - | - | 530-FCBGA (16x9.5) |
|
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5CSTFD5D5F31I7NIC SOC CORTEX-A9 800MHZ 896FBGA |
4,299 | - |
|
Datasheet | Cyclone® V ST | 896-BGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 64KB | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 800MHz | FPGA - 85K Logic Elements | -40°C ~ 100°C (TJ) | - | - | 896-FBGA (31x31) |
System On Chip (SoC) FAQ
Common questions about selecting, comparing and sourcing System On Chip (SoC) components through Winsun (HK) Electronics.
What should I check when selecting System On Chip (SoC) components?
Compare the manufacturer part number, electrical specifications, package, operating conditions and application requirements. The product datasheet should be used to confirm technical suitability.
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Yes. Send the exact part number, manufacturer and required quantity. Winsun (HK) Electronics can assist with availability checks, quotation support and sourcing options based on your requirement.
Do you support shortage, obsolete or hard-to-find System On Chip (SoC) parts?
Yes. Our sourcing team can review shortage and obsolete-part requirements and help check available supply channels or possible alternatives when appropriate.
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Submit an RFQ with the part number, manufacturer, quantity and target delivery requirement. Our sales team will review your request and follow up with current sourcing information.
